Home
Products
About Us
Factory Tour
Quality Control
Contact Us
Request A Quote
Home ProductsThermally Conductive Material

Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

Good quality Thermoelectric Air Conditioner for sales
Good quality Thermoelectric Air Conditioner for sales
Your company make perfect thermoelectric assembly products, we have been working together very happily in the past years .

—— Juergen Kreis

Nice supplier, perfect goods , perfect delivery !

—— Chana

I'm Online Chat Now

Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

China Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density supplier
Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density supplier Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density supplier

Large Image :  Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

Product Details:

Place of Origin: China
Brand Name: Adcol
Certification: ISO9001, CE
Model Number: A-gapfill 280

Payment & Shipping Terms:

Minimum Order Quantity: 10
Price: Negotiation
Packaging Details: Solid carton packaging
Delivery Time: 3 - 4 weeks
Payment Terms: T/T , Paypal
Supply Ability: 100kpcs per month
Contact Now
Detailed Product Description
Color: Light Gray Thickness: 0.08" (2.032mm)
Thickness Tolerance: ±0.008" (±0.20mm) Density: 1.73 G / Cbm
Hardness: 45 Shore A Tensile Strength: 48 Psi

Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

 


​A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not requiring additional adhesive coating, the
​A-gapfill 200 can inhibit thermal performance. This gap filler is both electrically insulating and stable from -40°C to 160°C and meets UL 94 VO rating.

FEATURES
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)

APPLICATIONS
• Cooling components to the chassis or frame
• High speed mass storage drives
• RDRAM memory modules
• Heat pipe thermal solutions
• Automotive engine control units
• Wireless communication hardware

  A-gapfill 280
Construction & Composition Ceramic filled
silicone elastomer
Color Light Gray
Thickness 0.08" (2.032mm)
Thickness Tolerance
± 0.008" (± 0.20mm)
Density 1.73 g/cm3
Hardness 45 Shore 00
Tensile Strength 48 psi
% Elongation 60.6
Outgassing TML
(post cured)
0.34%
Outgassing CVCM
(post cured)
0.10%
UL Flammability Rating 94 VO
Temperature Range -45°C to 160°C
Thermal Conductivity 1.1 W/mK
Total Thermal resistance @ 100 psi @69KPa 2.51 °C-in2/W
16.19 °C-cm2/W
Coefficient of Thermal Expansion 229 ppm/°C
35°C to 130°C
Breakdown voltage >27,000 Volts
Volume resistivity 4 x 1013 ohm-cm
Dielectric constant @ 1MHz 5.5

 

STANDARD THICKNESS
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory for alternate thicknesses

STANDARD SHEET SIZE
9" x 9" (229mm x 229mm) A-gapfill 200 may be die cut into individual shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.

REINFORCEMENT
0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.
Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

Contact Details
Adcol Electronics (Guangzhou) Co., Ltd.

Contact Person: admin

Send your inquiry directly to us (0 / 3000)